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Technical Development

wBGA

wBGA (Window Ball Grid Array) is a semiconductor package with a slot opened in a chip-carrying substrate for passing bonding wires through the slot to electrically connect the substrate to the chip where the chip is attached to the top of the substrate. Then external terminals such as solder balls are disposed on the bottom surface of the substrate for mounting to an external printed circuit board.

‧ Application

Computer, Communication, and Consumer Devices, Memory (SRAM, PSRAM, Flash, DRAM) package.

‧ Reliability Test
Test Item Test Condition
Precondition (MSL3 ) Baking 24Hrs 125C+ Moisture Soak Level 3 192Hrs 30C/60% RH+ 3 x 260C Reflow)
High Accelerated Stress Test 144 Hrs High Accelerated Stress Test 130C , 85%RH + MSL3 Preconditioning
Temperature Cycling Test 500/1000 cycle Temperature Cycling Test -55C to 125C,2 cycle/hour + MSL3 Preconditioning
High Temperature Storage Test 500/1000 Hrs High Temperature Storage Test 150C + MSL3 Preconditioning


FBGA

FBGA (Fine Pitch Ball Grid Arryay) is a smaller version of BGA package that follows JEDEC standard outline dimension for DRAM products. As in all BGA packages, FBGA is near-chip-scale in size, with a smaller and thinner body than the standard BGA package and to provide better electrical performance. As its name implies, it also features a finer ball pitch (smaller distance between balls).

‧ Application

Graphics, Communications, Networking , Microprocessors/Controllers , ASIC, Gate Arrays, Memory Packages

‧ Reliability Test
Test Item Test Condition
Precondition (MSL3 ) Baking 24Hrs 125C+ Moisture Soak Level 3 192Hrs 30C/60% RH+ 3 x 260C Reflow)
High Accelerated Stress Test 144 Hrs High Accelerated Stress Test 130C , 85%RH + MSL3 Preconditioning
Temperature Cycling Test 500/1000 cycle Temperature Cycling Test -55C to 125C,2 cycle/hour + MSL3 Preconditioning
High Temperature Storage Test 500/1000 Hrs High Temperature Storage Test 150C + MSL3 Preconditioning


DDP & QDP

DDP (Double Die Package) , to increase storage capacity, a non-volatile memory device such as a NAND flash memory may have multiple stacks of memory dies (e.g., chips) to thereby form a memory die package.

QDP (Quad Die Package)

‧ Application

Computer, Communication, and Consumer Devices, Memory (SRAM, PSRAM, Flash, DRAM) package.

DDP Structure

QDP Structure

QDP Structure



Features

‧ Single-Die wBGA :
Package Dimension(mm) Row / Block Column / Block Block Total Unit / Strip Product Application
X Y Z
7.5 12 1.2 5 9 3 135 DDR4 78 balls
13 1.2 5 9 3 135 DDR4 96 balls
10.5 1.2 6 9 3 162 DDR4 78 balls
8 10 1.2 6 9 3 162 DDR2 60 balls
10.5 10/1.2 6 9 3 162 DDR2 60 balls,DDR3 78 balls
11.5 1.2 5 9 3 135 DDR2 60 balls
12.5 1.2 5 9 3 135 DDR2 84 balls
13 10/1.2 5 9 3 135 DDR3 96 balls
9 10.5 10/1.2 6 8 3 144 DDR3 78 balls
10.6 1.2 6 8 3 144 DDR3 78 balls
13 10/1.2 5 8 3 120 DDR3 96 balls,DDR3 78 balls
10 10.5 1.2 6 7 3 126 DDR2 60 balls,DDR3 78 balls
12 1.2 5 7 3 105 DDR3 78 balls
12.5 1.2 5 7 3 105 DDR2 84 balls
13 1.2 5 7 3 105 DDR3 96 balls,DDR3 78 balls
15 1.2 5 7 3 105 DDR3 96 balls,DDR3 78 balls
11 11.5 1.2 5 6 3 90 DDR2 60 balls
‧ FBGA :
Package Dimension(mm) Row / Block Column / Block Block Total Unit / Strip Product Application
X Y Z
8 9 1.0 8 8 3 192 LPDDR 60 balls
13 1.0 8 5 3 120 LPDDR 90 balls
‧ Stacked-Die wBGA :
Package Dimension(mm) Row / Block Column / Block Block Total Unit / Strip Product Application
X Y Z
10 10.5 1.4 6 7 3 126 DDR3 78 balls Stacked-Die
13 1.4 5 7 3 105 DDR3 96 balls Stacked-Die
12 14 1.4 4 6 3 72 DDR3 136 balls Stacked-Die