Products & Service

Overview

Turnkey Assembly & Test Solution

Wafer Sort
  • 200mm & 300mm Wafer Probe Capabilities (including bumped wafer)
  • Experienced in Advanced RF, Mixed Signal, Logic & Analog Product
  • Inkless Wafer Map
Assembly
  • Substrate based with ball wBGA / FBGA
  • Substrate based without ball WSON/DFN
Package Test
  • Advanced RF, Mixed Signal, Logic and Analog Product
  • MSLP and Memory Final Test and Test Burn-In
  • Test program coding
  • Test Engineering support
Test EOL & Shipping
  • Laser Marking
  • 3D Lead Scan
  • Baking
  • Final Pack in Tray, Tape & Reel
  • Drop Shipment to Customer Designated Destination


Environment Control

Item Area Frequency
Warehouse Wafer Sort Final Test Assembly
Temperature 23C ±4°C 22C ±4°C 23C ±3°C 23C ±3°C Daily
6 hours
Humidity 50% ±10% 45% ±10% 50% ±10% 50% ±10% Daily
6 hours
Cleanliness
(ISO 14644-1)
NA ISO Class 6 ISO Class 8 FOL ISO Class 6
EOL ISO Class 7
Class 8:Quarterly
Class 7:Monthly
Class 6:Weekly